In many areas of industry technical plastics play a vital role in improving the efficiency and competitiveness of customer applications. Lightweight, versatile plastics have a proven track record stretching back over many years in the processing and testing of semiconductor products. Their success is based on a combination of material benefits which are brought to bear even under harsh chemical or different temperature level conditions.
In the process of semiconductor production, technical plastics can be used in a wide range of applications. The special demands imposed upon these materials are addressed by the outstanding properties of high performance plastics:
Some of the main plastics used in the semiconductor technology:
(PC) Easy to polish. Good machinability. Good welding and bonding properties
(PTFE) Particularly low coefficient of friction. Exceptional chemical resistance. Inherently flame resistant, self-extinguishing.
(PPS) Minimal thermal expansion. Very good electrical insulation properties. High strength, hardness and rigidity.
(PPS+GF) Fibre reinforced plastic. Excellent di-electrical properties
(PEEK) High thermal stability. Excellent dimensional stability. High degree of toughness.
(PEEK+GF) High temperature resistance. Dimensionally stable.
(PEEK+CERAMIC) High dimensional stability. Excellent hardness and rigidity. Good electrical insulation. High abrasion resistance.
(PEEK+MINERAL) High dimensional stability. Excellent rigidity and hardness.
(PET) Good machining properties. Very low moisture absorption. Very good electrical insulation properties.
(PAI) High long-term stability and high fatigue strength. Service temperature up to 270 °C
(PEI+GF) High temperature resistance. Inherently flame-retardant. Very strong and rigid.
(PI) Low outgassing in accordance with ESA standard. High rigidity with low weight.
(PI+GF) Reduced thermal expansion at high temperatures. Wear resistance. Dimensionally stable. Good machinability.
(PVDF) excellent chemical resistance for Cleaning tanks. PVDF is significantly more resistant to energetic radiation than all other fluoropolymers.
Potential applications are in front-end processes such as silicon manufacturing, plasma etching, photolithography, CMP (The Chemical Mechanical Planarization) and wafer cleaning, but also in back-end processes such as chip handling and device testing and much more.